hi-sincerity microelectronics corp. spec. no. : he6801 issued date : 1995.11.17 revised date : 2004.08.26 page no. : 1/4 hbav70 hsmc product specification hbav70 switching diode description the hbav70 consists of two diodes in a plastic surface mount package. the diodes are connected in series and the unit is designed for high-speed switching application in hybrid thick and thin-film circuits. features ? small smd package (sot-23) ? ultra-high speed ? low forward voltage ? fast reverse recovery time absolute maximum ratings ? maximum temperatures storage temperature ............................................................................................................ ............... -65 ~ +150 c junction temperature ........................................................................................................... ......................... +150 c ? maximum power dissipation total power dissipation (t a =25 c) ............................................................................................................... 250 mw ? maximum voltages and currents (t a =25 c) reverse voltage................................................................................................................ .................................. 70 v forward current................................................................................................................ ............................. 200 ma repetitive forw ard current..................................................................................................... ....................... 500 ma electrical characteristics (t a =25 c) characteristic symbol condition min max unit reverse breakdown voltage v (br) i r =100ua 70 - v v f(1) i f =1ma - 715 mv v f(2) i f =10ma - 855 mv v f(3) i f =50ma - 1100 mv forward voltage v f(4) i f =100ma - 1300 mv reverse current i r v r =70 - 5 ua total capacitance c t v r =0, f=1mhz - 1.5 pf reverse recovery time t rr i f =i r =10ma, r l =100 ? , measured at i r =1ma, v r =5v -15ns diagram: sot-23
hi-sincerity microelectronics corp. spec. no. : he6801 issued date : 1995.11.17 revised date : 2004.08.26 page no. : 2/4 hbav70 hsmc product specification characteristics curve forward biased voltage & forward current 0 150 300 450 0 500 1000 1500 2000 forward biased voltage-vf (mv) current-i f (ma) capacitance & reverse-biased voltage 0.1 1 0.1 1 10 100 reverse-biased voltage-v r (v) capacitance-cd (pf)
hi-sincerity microelectronics corp. spec. no. : he6801 issued date : 1995.11.17 revised date : 2004.08.26 page no. : 3/4 hbav70 hsmc product specification sot-23 dimension important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suit able for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. head office and factory: ? head office (hi-sincerity microelectronics corp.): 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel: 886-2-25212056 fax: 886-2-25632712, 25368454 ? factory 1: no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel: 886-3-5983621~5 fax: 886-3-5982931 h j k d a l g v c b 3 2 1 s dim min. max. a2.803.04 b1.201.60 c0.891.30 d0.300.50 g1.702.30 h 0.013 0.10 j 0.085 0.177 k0.320.67 l0.851.15 s2.102.75 v0.250.65 *: typical, unit: mm marking: pb free mark pb-free: " " (note) normal: none a4 note: pb-free product can distinguish by the green label or the extra description on the right side of the label. pin style: 1.anode 2.anode 3.cathode material: ? lead solder plating: sn60/pb40 (normal), sn/3.0ag/0.5cu or pure-tin (pb-free) ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 3-lead sot-23 plastic surface mounted package hsmc package code: n
hi-sincerity microelectronics corp. spec. no. : he6801 issued date : 1995.11.17 revised date : 2004.08.26 page no. : 4/4 hbav70 hsmc product specification soldering methods for hsmc?s products 1. storage environment: temperature=10 o c~35 o c humidity=65%15% 2. reflow soldering of surface-mount devices profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (t l to t p )<3 o c/sec <3 o c/sec preheat - temperature min (ts min ) - temperature max (ts max ) - time (min to max) (ts) 100 o c 150 o c 60~120 sec 150 o c 200 o c 60~180 sec tsm a x t o t l - ramp-up rate <3 o c/sec <3 o c/sec time maintained above: - temperature (t l ) - time (t l ) 183 o c 60~150 sec 217 o c 60~150 sec peak temperature (t p ) 240 o c +0/-5 o c 260 o c +0/-5 o c time within 5 o c of actual peak temperature (t p ) 10~30 sec 20~40 sec ramp-down rate <6 o c/sec <6 o c/sec time 25 o c to peak temperature <6 minutes <8 minutes 3. flow (wave) soldering (solder dipping) products peak temperature dipping time pb devices. 245 o c 5 o c 5sec 1sec pb-free devices. 260 o c +0/-5 o c 5sec 1sec figure 1: temperature profile t p t l ramp-down ramp-up ts max ts min critical zone t l to t p t s preheat t l t p 25 t 25 o c to peak time temperature
|
